Method of fabricating a circuit board
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United States of America Patent
Stats
-
Jan 31, 2017
Grant Date -
Jul 5, 2012
app pub date -
Mar 14, 2012
filing date -
Aug 13, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. Thru-holes are used to connect the differential signal pairs to external components. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. At least some of the thru-holes and vias are drilled to reduce an electrically conductive stub length portion of the hole. The drilled portion of a hole includes a transition from a first profile to a second profile to reduce radio frequency reflections from the end of the drilled hole.
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