Thermal stabilization of temperature sensitive components
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United States of America Patent
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-
Jan 31, 2017
Grant Date -
Apr 7, 2016
app pub date -
Oct 2, 2014
filing date -
Oct 2, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An enclosure for thermally stabilizing a temperature sensitive component on a circuit board is provided. The enclosure comprises a first cover section configured to be mounted over a portion of a first side of the circuit board where at least one temperature sensitive component is mounted. The first cover section includes a first lid, and at least one sidewall that extends from a perimeter of the first lid. The enclosure also comprises a second cover section configured to be mounted over a portion of a second side of the circuit board opposite from the first cover section. The second cover section includes a second lid, and at least one sidewall that extends from a perimeter of the second lid. The first and second cover sections are configured to releasably connect with the circuit board.
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