Methods of forming stacked microelectronic dice embedded in a microelectronic substrate

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United States of America Patent

PATENT NO 9564400
APP PUB NO 20160148920A1
SERIAL NO

15009731

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Abstract

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Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material.

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Patent Owner(s)

  • INTEL CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Albers, Sven Regensburg, DE 57 773
Barth, Hans-Joachim Munich, DE 102 1499
Goetz, Edmund Dachau, DE 13 99
Mahnkopf, Reinhard Oberhaching, DE 33 290
Memmler, Bernd Riemerling, DE 16 202
Meyer, Thorsten Regensburg, DE 298 5164
Molzer, Wolfgang Ottobrunn, DE 22 81

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