Shaped and oriented solder joints

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9564412
APP PUB NO 20160086905A1
SERIAL NO

14961624

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present description relates to the field of fabricating microelectronic assemblies, wherein a microelectronic device may be attached to a microelectronic substrate with a plurality of shaped and oriented solder joints. The shaped and oriented solder joints may be substantially oval, wherein the major axis of the substantially oval solder joints may be substantially oriented toward a neutral point or center of the microelectronic device. Embodiments of the shaped and oriented solder joint may reduce the potential of solder joint failure due to stresses, such as from thermal expansion stresses between the microelectronic device and the microelectronic substrate.

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Patent Owner(s)

  • INTEL CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aleksov, Aleksandar Chandler, US 305 1203
Ganesan, Sanka Chandler, US 79 468

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