Wire bonded electronic devices to round wire
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United States of America Patent
Stats
-
Feb 7, 2017
Grant Date -
N/A
app pub date -
Jun 11, 2015
filing date -
Jun 11, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A disclosed circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, first and second cross wires attached to the substrate and disposed proximate the electronic device, and one or more wire segments attached to the substrate. The one or more wire segments have first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire, respectively. The first and second cross wires and the one or more wire segments are round wires having round cross sections. The first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. A first bond wire is connected to the electronic device and to the first portion of the one or more wire segments, and a second bond wire is connected to the electronic device and to the second portion of the one or more wire segments.
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