Apparatus, method and system for a modular light-emitting diode circuit assembly
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United States of America Patent
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Feb 14, 2017
Grant Date -
May 8, 2014
app pub date -
Oct 17, 2013
filing date -
Nov 2, 2012
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Abstract
Provided herein is an improved apparatus, method and system for providing a modular LED circuit assembly. Specifically, examples of the present invention include a modular LED circuit which may be scaled and used in a wide variety of form factors. One example of the present invention may provide an apparatus for supporting a light-emitting diode which includes an LED circuit board including a first major surface and a second major surface. The first major surface may include a first contact pad and a second contact pad, where each of the first contact pad and the second contact pad are configured to receive a respective connector from the LED. The second major surface of the LED circuit board may include a first area, a second area, and a third area, where a substrate is attached to the LED circuit board across the third area.
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