3-D stacked multiprocessor structure with vertically aligned identical layout operating processors in independent mode or in sharing mode running faster components

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United States of America Patent

PATENT NO 9569402
APP PUB NO 20130283008A1
SERIAL NO

13452078

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Abstract

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Three-dimensional (3-D) processor structures are provided which are constructed by connecting processors in a stacked configuration. For example, a processor system includes a first processor chip comprising a first processor, and a second processor chip comprising a second processor. The first and second processor chips are connected in a stacked configuration with the first and second processors connected through vertical connections between the first and second processor chips. The processor system further includes a mode control circuit to selectively configure the first and second processors of the first and second processor chips to operate in one of a plurality of operating modes, wherein the processors can be selectively configured to operate independently, to aggregate resources, to share resources, and/or be combined to form a single processor image.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Buyuktosunoglu, Alper White Plains, US 203 1360
Emma, Philip G Danbury, US 113 2184
Hartstein, Allan M Chappaqua, US 28 749
Healy, Michael B White Plains, US 36 197
Kailas, Krishnan Kunjunny Tarrytown, US 13 150

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