Testing through-silicon-vias

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United States of America Patent

PATENT NO 9570196
APP PUB NO 20140376324A1
SERIAL NO

14241407

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Embodiments generally relate to integrated circuit devices having through silicon vias (TSVs). In one embodiment, an integrated circuit (IC) device includes a field of TSVs and an address decoder that selectably couples at least one of the TSVs to at least one of a test input and a test evaluation circuit. In another embodiment, a method includes selecting one or more TSVs from a field of TSVs in at least one IC device, and coupling each selected TS V to at least one of a test input and a test evaluation circuit.

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Patent Owner(s)

  • RAMBUS INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ng, William N San Francisco, US 7 55
Vogelsang, Thomas Mountain View, US 163 1479
Ware, Frederick A Los Altos Hills, US 757 10947

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