Electronic device provided with an encapsulation structure with improved electric accessibility and method of manufacturing the electronic device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 14, 2017
Grant Date -
Apr 28, 2016
app pub date -
Sep 30, 2015
filing date -
Oct 24, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic device comprising: a semiconductor die integrating an electronic component; a leadframe housing the semiconductor die; a protection body, which surrounds laterally and at the top the semiconductor die and, at least in part, the leadframe structure, defining a top surface, a bottom surface, and a thickness of the electronic device; and a conductive lead electrically coupled to the semiconductor die. The conductive lead is modelled in such a way as to extend throughout the thickness of the protection body for forming a front electrical contact accessible from the top surface of the electronic device, and a rear electrical contact accessible from the bottom surface of the electronic device.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully