Semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9570384
APP PUB NO 20150340331A1
SERIAL NO

14818922

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Abstract

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A semiconductor device can include a substrate and a trace layer positioned in proximity to the substrate and including a trace for supplying an electrical connection to the semiconductor device. Conductive layers can be positioned in proximity to the trace layer and form a bond pad. A non-conductive thin film layer can be positioned between the trace layer and the conductive layers. The thin film layer can include a via to enable the electrical connection from the trace to the bond pad. A portion of the trace between the substrate and the plurality of conductive layers can have a beveled edge.

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Patent Owner(s)

  • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mcmahon, Terry Corvallis, US 28 118
Przybyla, James R Corvallis, US 59 1227
Vina, Robert Corvallis, US 1 0
White, Lawrence H Corvallis, US 50 730

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