Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks
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United States of America Patent
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Feb 14, 2017
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app pub date -
Jan 22, 2015
filing date -
Jan 22, 2015
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Abstract
Interposer circuitry (130) is formed on a possibly sacrificial substrate (210) from a porous core (130′) covered by a conductive coating (130″) which increases electrical conductance. The core is printed from nanoparticle ink. Then a support (120S) is formed, e.g. by molding, to mechanically stabilize the circuitry. A magnetic field can be used to stabilize the circuitry while the circuitry or the support are being formed. Other features are also provided.
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