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United States of America Patent

PATENT NO 9570416
APP PUB NO 20160035692A1
SERIAL NO

14870827

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A plurality of microelectronic assemblies are made by severing an in-process unit including an upper substrate and lower substrate with microelectronic elements disposed between the substrates. In a further embodiment, a lead frame is joined to a substrate so that the leads project from this substrate. Lead frame is joined to a further substrate with one or more microelectronic elements disposed between the substrates.

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Patent Owner(s)

  • TESSERA, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beroz, Masud Cary, US 103 3166
Haba, Belgacem Saratoga, US 718 20815
Mitchell, Craig S San Jose, US 38 2082

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