Recessed metal liner contact with copper fill
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United States of America Patent
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Feb 14, 2017
Grant Date -
N/A
app pub date -
Jun 13, 2016
filing date -
Feb 8, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A method of fabricating a contact above a source or drain region of an integrated circuit includes depositing a first liner conformally in a bottom and along a sidewall of a trench formed above the source or drain region, depositing a second liner conformally over the first liner, and stripping the first liner and the second liner from a portion of the sidewall from an opening of the trench to a height above the bottom of the trench. The method also includes depositing a third liner conformally over the second liner on the bottom and to the height above the bottom of the trench and on the portion of the sidewall, and depositing a metal fill to fill the trench.
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