Apparatus, method, and composition for far edge wafer cleaning

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United States of America Patent

PATENT NO 9576789
APP PUB NO 20140213056A1
SERIAL NO

13752415

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Abstract

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A wafer cleaning apparatus includes a polishing unit used in chemical mechanical polishing (CMP) of a wafer and a cleaning dispensing unit arranged to direct cleaning fluids toward a far edge of the wafer after the CMP of the wafer. A wafer cleaning method includes CMP of a wafer by a polishing unit and directing cleaning fluids toward a far edge of the wafer after the CMP of the wafer by a cleaning dispensing unit. Another method can include CMP, applying deionized water, and applying pH adjuster having a pH range from about 2 to about 13.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Ting-Kui New Taipei, TW 19 19
Lu, Hsin-Hsien Hsinchu, TW 34 254
Tsai, Jung-Tsan New Taipei, TW 7 14

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