Package on-package joint structure with molding open bumps

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9576888
APP PUB NO 20140264858A1
SERIAL NO

14159159

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Abstract

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A device comprises a bottom package comprising a plurality of metal bumps formed on a first side of the bottom package and a plurality of first bumps formed on a second side of the bottom package, a top package bonded on the bottom package, wherein the top package comprises a plurality of second bumps, and wherein second bumps and respective metal bumps form a joint structure and an underfill layer formed between the top package and the bottom package, wherein the metal bumps are embedded in the underfill layer.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ang, Ai-Tee Hsin-Chu, TW 27 224
Chen, Meng-Tse Changzhi Township, TW 100 1568
Chen, Wei-Yu Taipei, TW 709 6443
Cheng, Ming-Da Jhubei, TW 447 4774
Lin, Chun-Cheng New Taipei, TW 100 1465
Liu, Chung-Shi Hsin-Chu, TW 824 11367

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