Semiconductor devices comprising interconnect structures and methods of fabrication

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United States of America Patent

PATENT NO 9576904
APP PUB NO 20150357284A1
SERIAL NO

14827763

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Abstract

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Semiconductor devices comprise at least one integrated circuit layer, at least one conductive trace and an insulative material adjacent at least a portion of the at least one conductive trace. At least one interconnect structure extends through a portion of the at least one conductive trace and a portion of the insulative material, the at least one interconnect structure comprising a transverse cross-sectional dimension through the at least one conductive trace which differs from a transverse cross-sectional dimension through the insulative material.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sandhu, Gurtej S Boise, US 1215 32319
Sinha, Nishant Boise, US 168 2084
Smythe, John A Boise, US 47 785

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