Hybrid on-chip and package antenna

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United States of America Patent

PATENT NO 9577314
SERIAL NO

13796404

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Antenna devices, antenna systems and methods of their fabrication are disclosed. One such antenna device includes a semiconductor chip and a chip package. The semiconductor chip includes at least one antenna that is integrated into a dielectric layer of the semiconductor chip and is configured to transmit electromagnetic waves. In addition, the chip package includes at least one ground plane, where the semiconductor chip is mounted on the chip package such that the ground plane(s) is disposed at a predetermined distance from the antenna to implement a reflection of at least a portion of the electromagnetic waves.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liu, Duixian Scarsdale, US 102 4782
Natarajan, Arun S Corvallis, US 18 199
Plouchart, Jean-Olivier New York, US 77 842
Reynolds, Scott K Amawalk, US 47 1141

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