Wireless interconnect for an integrated circuit

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United States of America Patent

PATENT NO 9577322
APP PUB NO 20110199275A1
SERIAL NO

13124291

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Abstract

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A wireless interconnect for an integrated circuit and a method of making the wireless interconnect. The interconnect includes a first antenna and a second antenna arranged over a plurality of electrically conductive interconnects. The interconnect also includes a propagation layer. The first and second antennae are arranged in between the propagation layer and the electrically conductive interconnects.

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Patent Owner(s)

  • NXP B.V.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hoofman, Romano Geel, BE 18 584

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