Pluggable LGA socket for high density interconnects
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United States of America Patent
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Feb 21, 2017
Issued Date -
N/A
app pub date -
Oct 22, 2014
filing date -
Oct 22, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
In some embodiments, an apparatus includes a land grid array connector positioned above an electrical package. The apparatus also includes a channel housing positioned above the land grid array. The apparatus includes an electrical-to-optical transceiver positioned in an opening of a socket of the channel housing, wherein a tapered opening is formed above the electrical-to-optical transceiver in the channel housing after the electrical-to-optical transceiver is positioned in the opening of the socket of the channel housing. A gap of the tapered opening decreases progressively starting from the opening of the socket. A conductive wedge positioned in the gap of the tapered opening.
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