Controlling adhesives between substrates and carriers

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United States of America Patent

PATENT NO 9579893
APP PUB NO 20160368267A1
SERIAL NO

15257625

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.

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Patent Owner(s)

  • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bigford, Rosanna L Albany, US 6 7
Clark, Garrett E Corvallis, US 52 158
Friesen, Ed Corvallis, US 24 64
Rivas, Rio Corvallis, US 68 339
Thurber, Lawrence Albany, US 3 8

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