Etching liquid for film of multilayer structure containing copper layer and molybdenum layer
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United States of America Patent
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Feb 28, 2017
Grant Date -
May 2, 2013
app pub date -
May 27, 2011
filing date -
Jun 18, 2010
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Abstract
The present invention relates to an etching solution for a multilayer thin film containing a copper layer and a molybdenum layer, and a method of etching a multilayer thin film containing a copper layer and a molybdenum layer using the etching solution. There are provided an etching solution for a multilayer thin film containing a copper layer and a molybdenum layer, including (A) an organic acid ion supply source containing two or more carboxyl groups and one or more hydroxyl groups in a molecule thereof, (B) a copper ion supply source and (C) an ammonia and/or ammonium ion supply source, the etching solution having a pH value of from 5 to 8, and an etching method using the etching solution.
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