Manufacturing method of semiconductor device and semiconductor manufacturing apparatus

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United States of America Patent

PATENT NO 9583331
SERIAL NO

13957697

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Abstract

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A manufacturing method of a semiconductor device according to the present invention comprises cleaning a semiconductor substrate. A first chemical liquid for forming a water-repellent protection film and a second chemical liquid coating the first chemical liquid are supplied on a surface of the semiconductor substrate. Alternatively, the semiconductor substrate is immersed in the first chemical liquid coated with the second chemical liquid. The semiconductor substrate is then dried.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kimura, Shinsuke Yokkaichi, JP 25 137
Ogawa, Yoshihiro Yokkaichi, JP 208 2295

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