Water soluble mask formation by dry film lamination
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United States of America Patent
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Feb 28, 2017
Grant Date -
Oct 15, 2015
app pub date -
Dec 8, 2014
filing date -
Apr 14, 2014
priority date (Note) -
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Abstract
Methods and systems for forming water soluble masks by dry film lamination are described. Also described are methods of wafer dicing, including formation of a water soluble mask by dry film lamination. In one embodiment, a method involves moisturizing an inner area of a water soluble dry film. The method involves stretching the water soluble dry film over a surface of the semiconductor wafer, and attaching the moistened inner area of the stretched film to the surface of the semiconductor wafer. A method of wafer dicing may further involve patterning the water soluble dry film, exposing regions of the semiconductor wafer between the ICs, and etching the semiconductor wafer through gaps in the patterned water soluble dry film.
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