Volumetric integrated circuit and volumetric integrated circuit manufacturing method

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United States of America Patent

PATENT NO 9583410
APP PUB NO 20150270246A1
SERIAL NO

14221477

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Abstract

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A volumetric integrated circuit manufacturing method is provided. The method includes assembling a slab element of elongate chips, exposing a wiring layer between adjacent elongate chips of the slab element, metallizing a surface of the slab element at and around the exposed wiring layer to form a metallized surface electrically coupled to the wiring layer and passivating the metallized surface to hermetically seal the metallized surface.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Edelstein, Daniel C White Plains, US 301 6031
Gaynes, Michael A Vestal, US 118 1540
Shaw, Thomas M Peekskill, US 84 1411
Webb, Bucknell C Ossining, US 110 1082
Yu, Roy R Poughkeepsie, US 76 748

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