Multiple bond via arrays of different wire heights on a same substrate

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United States of America Patent

PATENT NO 9583456
SERIAL NO

14841381

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Abstract

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Apparatuses relating generally to a substrate are disclosed. In such an apparatus, first wire bond wires (“first wires”) extend from a surface of the substrate. Second wire bond wires (“second wires”) extend from the surface of the substrate. The first wires and the second wires are external to the substrate. The first wires are disposed at least partially within the second wires. The first wires are of a first height. The second wires are of a second height greater than the first height for coupling of at least one electronic component to the first wires at least partially disposed within the second wires.

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Patent Owner(s)

  • INVENSAS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Katkar, Rajesh San Jose, US 220 4423
Uzoh, Cyprian Emeka San Jose, US 329 9032

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