Method for producing a directional layer by cathode sputtering, and device for implementing the method
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United States of America Patent
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Mar 7, 2017
Grant Date -
May 28, 2009
app pub date -
Jan 2, 2008
filing date -
Jan 2, 2007
priority date (Note) -
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Abstract
For producing a directional layer for instance with constant nominal directionality, such as a low-retentivity layer with a preferred direction of magnetization or a support layer for such a layer by cathode sputtering on a substrate surface (4), the coating process takes place in a manner whereby particles emanating from a target surface (6) impinge predominantly from directions whose projections onto the substrate surface (4) lies within a preferred angular range surrounding the nominal direction. This is achieved for instance by positioning a collimator (8), encompassing plates (9) that extend at a normal angle to the substrate surface (4) parallel to the nominal direction in front of the substrate surface (4), but in lieu of or in addition to such positioning the location or movement of the substrate surface (4) relative to the target surface (6) can also be suitably adjusted or controlled.

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Patent Owner(s)
Patent Owner | Address | |
---|---|---|
EVATEC AG | HAUPTSTRASSE 1A TRÜBBACH 9477 |
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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Dubs, Martin | Maienfeld, CH | 20 | 116 |
Friedli, Hanspeter | Felsberg, CH | 2 | 21 |
Kadlec, Stanislav | Praha, CZ | 20 | 244 |
Rohrmann, Hartmut | Schriesheim, DE | 15 | 58 |
Weichart, Jürgen | Balzers, LI | 12 | 57 |
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