Method for testing through silicon vias in 3D integrated circuits
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United States of America Patent
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Mar 7, 2017
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app pub date -
Mar 8, 2016
filing date -
Mar 8, 2016
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Abstract
A design-for-test (DFT) architecture for testing a three dimensional (3D) integrated circuit, may comprise a two dimensional (2D) silicon layer n−1 and a 2D silicon layer n connected together with a through silicon via (TSV) having a first side and a second side; scannable latch circuits on said first side and said second side of said TSV, wherein said scannable latch circuits: control flow of data between said layer n−1 and said layer n and allow said TSV to be verified; allow launch and capture clocks to be applied with variable delay in order to perform an alternating current delay fault test between said layer n−1 and said layer n; and have a quiescent state supply current (IDDq) test function built in which allows selection of an input load for a unidirectional signal connection between said layer n−1 and said layer n.
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