Semiconductor package and method of fabricating the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9589842
APP PUB NO 20160225669A1
SERIAL NO

14993054

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Abstract

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A method of fabricating a semiconductor package is disclosed. The method includes disposing semiconductor chips on a support substrate, forming a protection layer covering top surfaces of the semiconductor chips, forming a molding layer covering the support substrate and the protection layer, and etching the molding layer to expose the protection layer.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Inho Seoul, KR 59 279
Kim, Donghan Osan-si, KR 131 1419
Kim, Jae Choon Incheon, KR 34 290
Song, Jikho Seoul, KR 5 15
Umemoto, Mitsuo Seongnam-si, KR 40 801

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