Solderless electrical interconnections in a high speed photonic package
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United States of America Patent
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Mar 7, 2017
Issued Date -
N/A
app pub date -
Jul 7, 2016
filing date -
Jul 13, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An assembly that provides solderless electrical interconnection between two devices provided with electrical contact lands that are distributed in plane Land Grid Arrays (LGA's). One of the devices can be a package containing an electronic or opto-electronic device and the other device can be a PCB. The alignment of the lands of the LGA's is provided by guides that include a frame having vertical walls and centering pins inserted into metallized via-holes provided in the PCB, the dimensions of the frame allowing the sliding insertion and extraction of the package. Electrical connection between the lands of the two LGA's is provided by a contactor pad placed between the package and the PCB. The assembly includes a cover removably attached to the frame by a locking mechanism, the cover being provided with one or more elastic members which exert a downward force over the package compressing it against the contactor pad.
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