Printed wiring board and method for manufacturing printed wiring board

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United States of America Patent

PATENT NO 9591771
APP PUB NO 20150163901A1
SERIAL NO

14564126

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Abstract

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A printed wiring board includes resin insulation layers, conductive layers formed on the resin insulation layers respectively such that each of the conductive layers is formed on a surface of each of the resin insulation layers, and via conductors penetrating through the resin insulation layers respectively such that the via conductors are connecting the conductive layers through the resin insulation layers. The conductive layers and the via conductors are formed such that each of the conductive layers and each of the via conductors includes an electroless copper-plated film, an intermediate compound layer having Cu3N+Cu(NH)x and formed on the electroless copper-plated film, and an electrolytic copper-plated film formed on the intermediate compound layer.

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Patent Owner(s)

Patent OwnerAddress
IBIDEN CO LTDOGAKI

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishikawa, Shinsuke Ogaki, JP 4 5
Nishioka, Hiroyuki Ogaki, JP 8 18

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