Wire bonded electronic devices to round wire
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United States of America Patent
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Mar 14, 2017
Issued Date -
N/A
app pub date -
Oct 30, 2015
filing date -
Oct 30, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A disclosed circuit arrangement includes a flexible substrate. A layer of pressure sensitive adhesive (PSA) is directly adhered to a first major surface of the substrate. One or more metal foil pads and electrically conductive wire are attached directly on a surface of the PSA layer. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly on the surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.
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