Microelectronic packages and assemblies with improved flyby signaling operation
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United States of America Patent
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Mar 14, 2017
Grant Date -
N/A
app pub date -
May 12, 2016
filing date -
May 12, 2016
priority date (Note) -
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Abstract
A microelectronic unit includes microelectronic elements having memory storage arrays. First terminals and second terminals at a surface of the microelectronic unit are configured for connection with corresponding first and second sets of circuit panel contacts which are coupled with conductors of a common signaling bus on the circuit panel. Front surfaces of first and second microelectronic elements define a plurality of first planes at a substantial angle to a second plane defined by the major surface of the circuit panel. Each of a plurality of delay elements within the microelectronic unit is electrically coupled with a signaling path of the common signaling bus between one of the first terminals and a corresponding second terminal. In such way, the delay elements may reduce adverse effects of additive signal energy reflected from the microelectronic packages back towards the common signaling bus.
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