Patterned conductive structure and method for forming the same
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United States of America Patent
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Mar 14, 2017
Grant Date -
Jun 30, 2016
app pub date -
Dec 26, 2014
filing date -
Dec 26, 2014
priority date (Note) -
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Abstract
A method for forming a patterned conductive structure is provided. The method includes forming a soluble layer on a surface of a substrate, wherein the soluble layer has an opening exposing a rough portion of the surface. A first conductive layer is formed on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening. The soluble layer and the first conductive layer on the soluble layer are removed, wherein a portion of the first conductive layer corresponding to the rough portion is remained on the substrate. A patterned conductive structure formed by the method is also provided.
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