Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate
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United States of America Patent
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Mar 14, 2017
Grant Date -
Jan 15, 2015
app pub date -
Dec 18, 2012
filing date -
Dec 22, 2011
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Abstract
A dry film includes a carrier film, a thermosetting resin composition layer, and a photocurable resin composition layer formed between the carrier film and the thermosetting resin composition layer. The thermosetting resin composition layer is formed by applying and drying a thermosetting resin composition. The photocurable resin composition layer is formed by applying and drying a photocurable resin composition. A method of producing a printed writing board includes forming a resin insulation layer which includes a thermosetting resin composition layer and a photocurable resin composition layer on the substrate, in the order of the thermosetting resin composition layer and the photocurable resin composition layer from a surface side of the substrate, patterning the resin insulation layer by photolithographic approach, and patterning the resin insulation layer by laser processing.
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