Method for cutting high-hardness material by multi-wire saw
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United States of America Patent
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Mar 21, 2017
Grant Date -
Jul 2, 2015
app pub date -
Aug 30, 2013
filing date -
Sep 3, 2012
priority date (Note) -
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Abstract
This method of cutting a high-hardness material with a multi-wire saw includes the steps of: (A) providing at least one ingot which includes a body portion 10a with two ends and a low-quality crystal portion 10e that is located at only one of the two ends of the body portion; (B) fixing the at least one ingot onto a fixing base; and (C) slicing the at least one ingot by moving the ingot with respect to a saw wire so that the saw wire does not contact with the low-quality crystal portion 10e of the at least one ingot but does contact with its body portion 10a.
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