High temperature stable thermally conductive materials

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United States of America Patent

PATENT NO 9598575
SERIAL NO

13990446

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Abstract

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Disclosed herein are compositions, preparation methods, and use of thermally conductive materials comprising silicone composition curable by hydrosilylation, thermally conductive fillers, and phthalocyanine. The novel composition retains its desirable pliability after cure even when kept at an elevated temperature for an extended period.

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Patent Owner(s)

Patent OwnerAddress
DOW SILICONES CORPORATION2200 WEST SALZBURG ROAD MIDLAND MI 48686-0994

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bhagwagar, Dorab Saginaw, US 23 135
Messing, Kelly Auburn, US 2 63
Wood, Elizabeth Midland, US 5 65

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