Methods to reduce debonding forces on flexible semiconductor films disposed on vapor-releasing adhesives
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United States of America Patent
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Mar 28, 2017
Grant Date -
Jan 12, 2017
app pub date -
May 2, 2016
filing date -
Jul 9, 2015
priority date (Note) -
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Abstract
A method comprises providing a handle substrate having a front surface and a back surface; providing a layer of flexible semiconductor material having a front surface and a back surface and an at least partially sacrificial backing layer stack on the back surface of the layer of flexible semiconductor material; bonding the front surface of the layer of flexible semiconductor material to the front surface of the handle substrate; removing at least a portion of the at least partially sacrificial backing layer stack from the back surface of the layer of flexible semiconductor material; opening outgassing paths through the layer of flexible semiconductor material; and processing the layer of flexible semiconductor material.
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