Thermoforming with precision in-lay
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United States of America Patent
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Apr 4, 2017
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N/A
app pub date -
Mar 12, 2012
filing date -
Mar 12, 2012
priority date (Note) -
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Abstract
A thermoforming in-lay technique is discussed that uses retractable pins to hold an in-lay piece securely in place in a primary mold. The in-lay piece is fabricated prior to the primary molding process and creates multiple pin receivers in the in-lay that are retractably engaged by the retractable pins when placed into the primary mold. When the primary substrate is formed into the primary mold, the retractable pins prevent the in-lay piece from moving out of position. Once the primary substrate has cooled sufficiently, the pins are retracted allowing the finished primary carrier art to be removed from the primary mold.
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