System and method for controllable non-volatile metal removal
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United States of America Patent
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Apr 4, 2017
Grant Date -
Sep 15, 2016
app pub date -
Mar 13, 2015
filing date -
Mar 13, 2015
priority date (Note) -
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Abstract
A system and method for removing metal from a substrate in a controlled manner is disclosed. The system includes a chamber, with one or more gas inlets to allow the flow of gasses into the chamber, at least one exhaust pump, to exhaust gasses from the chamber, and a heater, capable of modifying the temperature of the chamber. In some embodiments, one or more gasses are introduced into the chamber at a first temperature. The atoms in these gasses chemically react with the metal on the surface of the substrate to form a removable compound. The gasses are then exhausted from the chamber, leaving the removable compound on the surface of the substrate. The temperature of the chamber is then elevated to a second temperature, greater than the sublimation temperature of the removable compound. This increased temperature allows the removable compound to become gaseous and be exhausted from the chamber.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES INC | 35 DORY ROAD GLOUCESTER MA 01930 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Anthis, Jeffrey W | San Jose, US | 89 | 4744 |
Chen, Tsung-Liang | Danvers, US | 49 | 178 |
Gilchrist, Glen | Danvers, US | 10 | 19 |
Schmiege, Benjamin | Santa Clara, US | 29 | 1415 |
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11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 4, 2028 |
Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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