Hermetic sealing of optical module
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United States of America Patent
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Apr 4, 2017
Issued Date -
N/A
app pub date -
Sep 15, 2003
filing date -
Sep 15, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A hermetically sealable package may be formed from a top portion and a bottom portion mated along a seam at or near a plane of an optical fiber. A completed pill assembly may be positioned directly into the enclosure base without requiring the fiber to be threaded through the feed through or “snout”. The top potion may then be mated with the bottom portion to form the package. A glass solder ring may be placed coaxial with the fiber in the feed through. The seam may be sealed by laser welding and the glass solder ring reflowed by laser heating, for example, with a same laser as used to weld the seam or by resistive or induction heating.
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