Reduced-warpage laminate structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9613915
SERIAL NO

14557795

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A laminate structure includes a conductive layer and a dielectric layer in contact with the conductive layer, the dielectric layer comprises a selectively patterned high-modulus dielectric material that balances a differential stress between the conductive layer and the dielectric layer to mechanically stiffen the laminate structure and reduce warpage.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lamorey, Mark C Williston, US 22 196
Li, Shidong Poughkeepsie, US 65 155
Patel, Janak G South Burlington, US 38 368
Powell, Douglas O Endicott, US 39 989
Russell, David J Oswego, US 65 781
Slota,, Jr Peter Vestal, US 24 157
Stone, David B Jericho, US 59 648

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Oct 4, 2024
11.5 Year Payment $7400.00 $3700.00 $1850.00 Oct 4, 2028
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00