Manufacturing of a heat sink by wave soldering

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United States of America Patent

PATENT NO 9615444
APP PUB NO 20160081179A1
SERIAL NO

14951085

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder is applied to the second surface. The solder penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to join a thermal radiator and/or electronic contact of the electronic device to the vias. The solder further remains in the cavity to form a corresponding heat sink.

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Patent Owner(s)

Patent OwnerAddress
STMICROELECTRONICS INTERNATIONAL N V39 CHEMIN DU CHAMP DES FILLES 1228 PLAN-LES-OUATES GENEVA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cacciola, Rosalba Tremestieri Etneo, IT 4 17
Malgioglio, Giuseppe Luigi Catania, IT 2 9
Stella, Cristiano Gianluca San Gregorio di Catania, IT 36 150

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