Computing system enclosure airflow management
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United States of America Patent
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Apr 4, 2017
Grant Date -
Mar 30, 2017
app pub date -
Sep 29, 2015
filing date -
Sep 29, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
The disclosed technology provides systems and methods for an enclosure system with optimized internal dynamically controllable airflow distribution. The systems include a computing system enclosure, and an electroactive film adhered to a surface of the computing system enclosure and configured to redirect airflow distribution in the computing system enclosure. In another implementation, a method monitoring airflow distribution within a computing system enclosure with a plurality of sensors, and controlling an orientation of a programmable microstructure in an electroactive film adhered to a surface of the computing system enclosure based on results of the monitoring operation. In yet another implementation, the disclosed technology includes bimetallic baffles configured for utilization in a computing system enclosure to redirect airflow distribution within the computing system enclosure.
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