Method of manufacturing element substrate

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9616666
APP PUB NO 20160059562A1
SERIAL NO

14820823

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Provided is a method of manufacturing an element substrate, including: forming first and second resists on a predetermined surface of a substrate so that part of the predetermined surface is exposed; etching the substrate with the first and second resists being used as a mask to form a first recess in the substrate; removing the second resist to expose a portion of the substrate that is different from the first recess; etching the substrate with the first resist being used as a mask to deepen the first recess and to form a second recess communicating with the first recess in the substrate; and covering openings of the first and second recesses with an orifice forming member to form a pressure chamber by the first recess and an orifice forming member and to form a flow reducing portion by the second recess and the orifice forming member.

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Patent Owner(s)

  • CANON KABUSHIKI KAISHA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakakubo, Toru Kawasaki, JP 82 367
Watanabe, Shinichiro Kawasaki, JP 71 463
Yoshioka, Toshifumi Hiratsuka, JP 37 431

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