Method for direct metallization of non-conductive substrates

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United States of America Patent

PATENT NO 9617644
APP PUB NO 20130316082A1
SERIAL NO

13636087

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Abstract

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The present invention relates to a method for direct metallization of non-conductive substrates as well as a conductor solution used in such a method. According to the invention, it is proposed to contact a non-conductive substrate surface after activation by a noble metal colloid-containing activator solution with a conductor solution, which comprises a metal that is reducible by a metal of the activator solution, a complexing agent and a reducing agent.

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CITIBANK N A388 GREENWICH STREET NEW YORK NY 10013

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dahlhaus, Markus Schermbeck, DE 2 11
Elbick, Danica Solingen, DE 5 20
Königshofen, Andreas Leverkusen, DE 7 17

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