Routing design for high speed input/output links
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United States of America Patent
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Apr 11, 2017
Grant Date -
Mar 13, 2014
app pub date -
Sep 11, 2012
filing date -
Sep 11, 2012
priority date (Note) -
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Abstract
Certain embodiments relate to routing structures and their formation. In one embodiment a routing structure includes a first region including a first layer comprising alternating signal traces and ground traces separated by a dielectric. The first region also includes a second layer including alternating signal traces and ground traces separated by a dielectric, wherein the second layer signal positioned over the first layer ground traces, and the second layer ground traces positioned over the first layer signal traces. The first region may also include additional layers of alternating signal and ground traces. The first region may also be formed with the ground traces having a width that is larger than that of the signal traces. The routing structure may also include a second region including pads to which the traces are coupled. Other embodiments are described and claimed.
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