Carrier-tape fabrication die and carrier-tape fabrication method
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United States of America Patent
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Apr 18, 2017
Grant Date -
Jun 19, 2014
app pub date -
Dec 12, 2013
filing date -
Dec 14, 2012
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A die for fabricating a carrier tape such that the carrier tape is provided with a plurality of housing holes for housing electronic components therein in a state where the housing holes are arranged in a longitudinal direction and penetrates the carrier tape in a thickness direction. The die is less prone to be damaged and is less prone to induce breakages in the interval portions between the housing holes in the carrier tape. A male die includes housing-hole formation convex portions which are constituted by a plurality of first housing-hole formation convex portions having respective tip ends at a relatively-higher heightwise position, and a plurality of second housing-hole formation convex portions having respective tip ends at a relatively-lower heightwise position.
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