Method of HIPIMS sputtering and HIPIMS sputter system

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United States of America Patent

PATENT NO 9624572
SERIAL NO

14765975

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Abstract

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So as to control the operation of a sputter target (9) during lifetime of the target and under HIPIMS operation part (I) of a magnet arrangement associated to the target (9) is retracted from the target (9) whereas a second part II of the magnet arrangement is, if at all, retracted less from the addressed backside (7) during lifetime of the target (9). Thereby, part I is closer to the periphery of target (9) than part II, as both are eccentrically rotated about a rotational axis (A).

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Patent Owner(s)

Patent OwnerAddress
EVATEC AGHAUPTSTRASSE 1A TRÜBBACH 9477

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Rieschl, Sven Uwe Malans, CH 4 38
Weichart, Juergen Balzers, LI 16 108

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