Semiconductor device

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United States of America Patent

PATENT NO 9627340
APP PUB NO 20160351502A1
SERIAL NO

14847544

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Abstract

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According to one embodiment, a semiconductor device includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip outputs a first signal by a first bus width and includes a first via which transfers the first signal. The second semiconductor chip receives, by the first bus width, the first signal transferred through the first via.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kouchi, Toshiyuki Kawasaki, JP 23 169

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