Packages and methods for forming the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9627369
APP PUB NO 20150243642A1
SERIAL NO

14706541

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Abstract

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A device includes a package component having conductive features on a top surface, and a polymer region molded over the top surface of the first package component. A plurality of openings extends from a top surface of the polymer region into the polymer region, wherein each of the conductive features is exposed through one of the plurality of openings. The plurality of openings includes a first opening having a first horizontal size, and a second opening having a second horizontal size different from the first horizontal size.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Meng-Tse Changzhi Township, TW 100 1568
Cheng, Ming-Da Jhubei, TW 447 4774
Lin, Chun-Cheng New Taipei, TW 100 1465
Lin, Hsiu-Jen Zhubei, TW 172 1408
Liu, Chung-Shi Hsin-Chu, TW 824 11367
Tsai, Yu-Peng Taipei, TW 43 1203

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